HB100 Automatic Wire Bonder

With motorized Z-Y-X Axis and Bond Head Rotation

The motorized Z-Y-X Axis and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes.

HB100 Automatic Wire Bonder

With motorized Z-Y-X Axis and Bond Head Rotation

The motorized Z-Y-X Axis and the rotatable Bond Head are the key to configure, safe and execute automatic Bond processes.

21" HighRes

21“ Touchscreen
Higher Resolution
Higher Productivity

The newly developed graphic interface of the TPT HB100 is optimized for automatic bonding. But laboratories and small production lines will have met all their needs also.

One Bond Head

for Wedge, Ball, Bump, & Ribbon

With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.

Workspace

very large for bigger cases or multiple substrates

Big or unusual substrates and cases will have more then enough space on our HB100. Even better, combine it with one of our larger heater stages.

21" HighRes

21“ Touchscreen
Higher Resolution
Higher Productivity

The newly developed graphic interface of the TPT HB100 is optimized for automatic bonding. But laboratories and small production lines will have met all their needs also.

HB100 Video

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One Bond Head

for Wedge, Ball, Bump, & Ribbon

With our machines there is no need to change the bond head, no matter the application. Just switch tool tips, fast and easy. All bonding modes are at your disposal any time.

Workspace

very large for bigger cases or multiple substrates

Big or unusual substrates and cases will have more then enough space on our HB100. Even better, combine it with one of our larger heater stages.

HB100

Automatic Wire Bonder
perfect for single case use and small production lines

TPT_Icons_auto_ball

Automatic Wire Bonder

motorized z-y-x axis and rotatable bond head for automatic bond processes

TPT_Icons_Pattern_Rec

Pattern Recognition

automatic position correction through machine vision

2

One Bond Head

wedge, ball, bump & ribbon bonding

1

17µm to 75µm Wire

Ggold, aluminum, silver & copper wire

4

Touch Screen

large 21″ highresolution TFT

6

Simple Loop Programming

create individual loop profiles consisting of up to 10 steps

5

Automatic Bond Height Adjustment

z-axis sensor identifies touch down and sets height parameters

8

Deep & Wide Bond Access

ample workspace due to special bond head design

9

Motorized Wire Clamp

precise tail length control

Questions?

Get a quote now!

SalesSH

Stephan Hausmann

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Distributors

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About TPT

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SalesSH

Stephan Hausmann

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Weltkarte_03_mit_BG_675_675

Distributors

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tpt_logo_rgb

About TPT

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Wire Bonder Datasheets

Wire Bonder Datasheets