10 Reasons to buy TPT Bonder

1. Quick & Easy Changeover Between Ball & Wedge Bonding (HB05/10/16)

1. Change the bond tool type

2. Thread the wire through the bond tool

3. Select the appropriate bonding program

2. True Deep Access - Vertical Bond Head Movement (HB06/08/10/12/14/16/30)

An integrated Z axis Touch-Down-Sensor

means that stage adjustments for different bond heights are not necessary

3. Loop Profile Software (HB12/14/16/30)

100 independent, 10 stage loop profiles programs can be saved.

4. Deep Access & Long Reach Bond Head (all Model)

A long-reach transducer, with the wire clamp positioned above the bonding tool,

provides excellent clearance for deep access / large area bonding.

5. Up To 100 Programs Stored To Memory (HB12/14/16/30)

An additional 100 programs can be backed up to an USB-Memory

6. Motorised Wire Clamp (all Model)

Precision tail-lengths are achieved by the use of a sophisticated motorized wire clamp.

7. Motorised Wire Spool (all Model)

For large wire spools and consistent feed / looping

8. 6,5“ TFT Touch Panel User System (HB12/14/16/30)

Fast and easy access with digital adjustment of all bonding parameters

9. Stud Bump Bonding (HB04/05/08/10/14/16)

All ball bonding capable systems also incorporate a Stud bump-bonding mode

10. Made in Germany (all Model)

TPT is located in Karlsfeld near Munich in Germany.