H80 Pick and Place Kit for HB10 and HB16

1. Stamp

2. Place

3. Bond

Pick & Place Kit

• Easy change from wire
  bonding to die bonding
  
  
• 6 to 1 fine ratio manipulator
  
  
• programmable force
  15cN up to 100cN
  
  
• programmable time from
  up to 5000msec